ibm new cooling solution

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IBM new cooling solution

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IBM new cooling solution

POSTER: computer news || IBM NEW COOLING SOLUTION

DATE:2008-06-06

IBM engineers already develop a liquid cooling system for servers systems for more energy efficiency and ecology , This company attempt to increase the effectiveness of electronic components arrangement with the creation of many-storeyed microcircuits.
In fifty years IBM plans to use in its multi-core server multistage processors. The number of connections between microcircuits with this layout grows by one hundred, and the occupied surface area decreases by ten. Since water is 4000 times better to cool microcircuits in comparison with air, developers decided to supply such chips with a system from the finest channels, in order to pump through the water.

Each microcircuit layer is pierced in 10 000 channels with a thickness not more than 50 m and height not more than 100 m. From the multistage chip with 4 sq. cm area this cooling system is capable of removing up to 180 W of thermal energy.

The first servers with the use of this cooling principle can be released by IBM company in 2013.

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IBM new cooling solution

IBM NEW COOLING SOLUTION

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