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We already reported that according to intel X86 architecture ( larrabee ) will be able to extrude CUDA and CTM platform. According to Patrick Gelsinger, intel efforts will be observed as minimum in ten years. In this case the company will be able to master technological standards 32 nm, 24 nm, 15 nm and 10 nm. The quantity of companies, capable of building new semiconductor factories, will be reduced. For passage to silicic plates production with 450mm diameter it is necessary to put $1 billion Intel was combined with TSMC and Samsung in order to reduce risks and financial load from the passage to 450 plates. The beginning of microcircuits production using this standard is planned in 2012.
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