LGA 1366 processors will larger than their predecessors, and therefore for their cooling a new coolers will be required Furthermore, TDP level for core i7 processors will reach 130 W, and not each LGA 775 cooler can work with such high TDP .
Associates obtained at their disposal the processor cooler models . The attaching holes for LGA 1366 cooler is located at 80 mm distance each from other, whereas for LGA 775 this distance is 72 mm. actually, some productive cooler will be for sure supplied with the fastening elements, which allow to add compatiblity with LGA 775 and LGA 1366.
The Great deference will be the base area , which make contacts with the cover of heat-distributor. Thus, in LGA 1366 processors the dimensions of this cover are equal to 32 X 35 mm. the cover of heat-distributor for LGA 775 processors is equal to 28,5 X 28,5 mm.