Microcircuits semiconductor producers are prepared for passage on 32 nm technical process. Soon Intel, AMD, IBM and TSMC companies will demonstrate the appropriate storage cells (SRAM) . This means that the successor of 45 nm technical process will be mastered by chief producers in 1.5 year.
TSMC Company is ready to begin the production of chips on 32 nm technology in 2009. Through a pair of years this company will master the 22 nm technical process , and up to 2013 they will reach the 15 nm lithographic boundary.
In particular, according to the estimations of TSMC representatives , after passage on 32 nm technology the decrease for production expenditures will be already impossible. For example, if it was possible to reduce by 29% yearly in the period from 1993 through 2003 expenditure, then in the period from 2003 through 2018 the reduction rate composed only 26% in the annual expression.
According to TSMC representatives , one of the improvement methodsĀ could become the migration on 450 mm silicic plates. However, some experts consider that the migration on 450 mm silicic plates will start only in 2017.
Let us note that the reconstructed AMD factory will also release video chip on 32 nm technology (Fab 38). Thus, for TSMC will appear a new competitor in the 32 nm chips production, which previously used its services. According to AMD management , the production of chips at its own factory will not influence the relations with TSMC, and a part of production will be as before released by TSMC.