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TSMC Company, which is one of the most important semiconductor microcircuits producers, already expressed its relation to the passage to 450 mm silicic plates. In its opinion, 450 mm plates in 2014 will allow producers to improve the economic return of technological processes. TSMC recognize, that the global economic problems will hold the passage to the new technical processes and 450 mm plate.
According to associate TSMC company searches for supports in numbers of lithographic equipment suppliers for its initiative on the passage on 450 mm plate.
If the passage from 200 mm diameter to 300 mm increased the quantity of chips by 2,65 times, then the transfer from 300 to 450 mm will allow to increase the chips quantity by 2,7 times. Specific expenditures for equipment and materials will be reduced by 1,2-1,7.
For the achievement of such step a big enough capital investments is required. According to the estimations of some experts, even without the influence of financial crisis, the suitable moment for introducing 450 mm plates will begin not earlier than 2017. Related Products :
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